Features:
- Stencil magnetic suction leveling, free hands; scraping tin does not move, more uniform, with the magnet base to use, planting tin is more simple and convenient, not easy drums
- Innovative slope design, so that the chip is more closely, compatible with thinner chip C, pads do not overhang more evenly
- Good compatibility, suitable for 0.9mm thickness chip, most of the current mobile phone chip auxiliary tin planting
- Strong expandability, applicable to more than 50mm size stencil, supports Amaoe single CPU mesh, integrated mesh, CPU integrated mesh, and so on.
- High-temperature resistance, good heat insulation effect, heat insulation pad with adhesion characteristics, non-slip and non-displacement
- Soft and not easy to deform, good elasticity, can be curled at will, not attenuated deformation for a long time