KAISI BGA iC Glue Remover Liquid

How to Use:

• 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
• 2. Place a plastic bag or film on the top and cover the PCB board.
• 3. Wait for about 20 minutes.
• 4. Redo step 1 to step 3.
• 5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.
• 6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.
• 7. To remove the chip with a tweezers or cutter