Mijing Z21 Max BGA Stencil Platform Set for Android / Hisilicon / Qualcomm Snapdragon IC Chip Planting Tin Template Fixture

Features:

Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping

Installation Method:

Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

Package includes:

1 x Tin planting platform set