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343S00286 iPad Mini 5 Power Management IC
SKU: ip112
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₨ 4,500
In Stock
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SKU: ip112 Categories: iCs iPhone, iPad Etc Series Tags: 323s00286, 343s00286 power ic, ipad 5 mini power ic, ipad 5 power ic, ipad power ic
343S00286 iPad Mini 5 Power Management IC
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iPhone11 11PRO 11PROMAX fast charge ic SPTMB1How to replace iphone iC chips?*Remove the chip cleanly, with hot air.
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*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
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*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
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*Put on a reballing stencil.
*Spread some soldering paste.
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*Extract the chip by pushing with a thin tweezers.
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*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
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*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
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*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
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*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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