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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
-
- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
-
Density
- 64 Gb
-
Organization
- x64
-
Speed
- 6400 Mbps
-
Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
-
Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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![Relife SAM EU4 Exynos CPU Stencil For Samsung 3830, Exynos 9609, 2100, 8895, 1080, 9815 CPU](https://dhics.pk/wp-content/uploads/2024/09/b-400x400.jpg)
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Relife SAM EU4 Exynos CPU Stencil For Samsung 3830, Exynos 9609, 2100, 8895, 1080, 9815 CPU
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![Relife SAM EU3 Exynos CPU Stencil For Exynos 9820, 9610, 990, 7885, 980 CPU](https://dhics.pk/wp-content/uploads/2024/09/a-400x400.jpg)
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Relife SAM EU3 Exynos CPU Stencil For Exynos 9820, 9610, 990, 7885, 980 CPU
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![iPhone X big power ic 338S00341 Refurbish](https://dhics.pk/wp-content/uploads/2024/06/338S00341-B1-400x400.jpg)
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iPhone X big power ic 338S00341
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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![Samsung S23 Ultra SM-S918U-W / 0 / D Middle Frame Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st11-400x400.png)
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Samsung S23 Ultra | SM-S918U-W / 0 / D Middle Frame Reballing Stencil
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![Samsung S22 SM-S901U/W/O/D/E Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st10-400x400.png)
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Samsung S22 SM-S901U/W/O/D/E Reballing Stencil
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![S21+SM-G996U/O/D/W middle frame Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st6-400x400.png)
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S21+SM-G996U/O/D/W middle frame Reballing Stencil
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![Samsung S20 SM-G980F G981BN Middle Layer Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st5-400x400.png)
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Samsung S20 SM-G980FG981BN Middle Layer Reballing Stencil
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![Samsung S20 SM-G986B 985F 986B Middle Layer Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st4-400x400.png)
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Samsung S20 SM-G986B 985F 986B Middle Layer Reballing Stencil
₨ 1,300 Add to cart
Only 9 left in stock
Samsung S20 SM-G986B985F986B Middle Layer Reballing Stencil
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![Samsung S20 SM-G986B 985F 986N Middle Layer Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st3-400x400.png)
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Samsung S20 SM-G986B985F986N Middle Layer Reballing Stencil
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![Samsung S20-G988B BR Middle Layer Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st2-400x400.png)
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Samsung S20-G988BBR Middle Layer Reballing Stencil
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![Samsung S10 5G-G977 Middle Layer Reballing Stencil](https://dhics.pk/wp-content/uploads/2023/08/st1-400x400.png)
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Samsung S10 5G-G977 Middle Layer Reballing Stencil
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![iPhone XS XR MAX power amplifier IC 76018](https://dhics.pk/wp-content/uploads/2023/06/95-1-400x400.png)
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iPhone XS XR MAX power amplifier IC 76018
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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![iPhone XS XR MAX power amplifier IC 2018-15](https://dhics.pk/wp-content/uploads/2023/07/WhatsApp-Image-2023-07-04-at-15.04.36-400x400.jpg)
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iPhone XS XR MAX power amplifier IC 2018-15
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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![iPhone XS XR MAX power amplifier IC 203-15](https://dhics.pk/wp-content/uploads/2023/06/93-1-400x400.png)
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iPhone XS XR MAX power amplifier IC 203-15
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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