Characteristics:

• EFFICIENT THERMAL CONDUCTIVITY: Silicone-based thermal pad with special filling outperforms generic and performance pads by far. Thermal conductivity equals 3.5 W/mK.

• GAP FILLER: Due to its low hardness and high compressibility, the thermal pad works as the perfect filler and fills uneven surfaces and gaps with no problem.

• SAFE HANDLING: The pad contains no metallic particles, is electrically insulating and non-capacitive. A contact with any electrical trace would not result in damage of any kind. Safe and easy handling.

• EASY AND QUICK TO APPLY: Installing the heat pad is child's play and perfect for beginners. The ideal high-performance gap filler! Electrically non-conductive.

• High thermal conductivity rate; Soft and sticky. Easy to apply.

• Maximum thermal conduction and increased cooling. Can be cut to any desired size.

• Reduce heatsink effectiveness and increase processor/graphics card operating temperature.

• With this pad to greatly reduce gpu temperatures, it can be used for graphics, northbridge, memory chipset, IC chips.

• Material: conduction silicone

• Continuous temp: -40 degrees-260 degrees

• Thermal conductivity: 3.5 w/mK

• Breakdown Voltage: 4kv/m