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Thermal Cooling Heatsink Pad, Conductive Silicone Pad, GPU, CPU Pre Cut 2.0
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₨ 1,600
In Stock
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Characteristics:
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EFFICIENT THERMAL CONDUCTIVITY: Silicone-based thermal pad with special filling outperforms generic and performance pads by far. Thermal conductivity equals 3.5 W/mK.
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GAP FILLER: Due to its low hardness and high compressibility, the thermal pad works as the perfect filler and fills uneven surfaces and gaps with no problem.
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SAFE HANDLING: The pad contains no metallic particles, is electrically insulating and non-capacitive. A contact with any electrical trace would not result in damage of any kind. Safe and easy handling.
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EASY AND QUICK TO APPLY: Installing the heat pad is child’s play and perfect for beginners. The ideal high-performance gap filler! Electrically non-conductive.
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High thermal conductivity rate; Soft and sticky. Easy to apply.
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Maximum thermal conduction and increased cooling. Can be cut to any desired size.
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Reduce heatsink effectiveness and increase processor/graphics card operating temperature.
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With this pad to greatly reduce gpu temperatures, it can be used for graphics, northbridge, memory chipset, IC chips.
Parameters:
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Material: conduction silicone
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Continuous temp: -40 degrees-260 degrees
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Thermal conductivity: 3.5 w/mK
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Breakdown Voltage: 4kv/m
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