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Showing 1–16 of 64 resultsSorted by latest

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YCS Solder Wick 2023 2.3mm (5 Pcs Roll)
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YCS Solder Wick 2023 2.3mm (1 Pcs)
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YCS Solder Wick 2015 2.0mm (5 Pcs Roll)
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YCS Solder Wick 2015 2.0mm (1 Pcs)
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Solder Wick 1.5mm MaAnt MY-1515
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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
-
- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
-
Density
- 64 Gb
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Organization
- x64
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Speed
- 6400 Mbps
-
Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
-
Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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2UUL Gun Type Solder Away Wick 2.0mm
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2UUL Solder Away Desoldering Wick 2.0mm
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Solder Wick 2.5mm KOOCU CP2015
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Huawei P30 Pro Middle Layer StenciL
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U-HIU2 For Huawei CPU Kirin990-H13690 5G, Kirin990-H13690 4G, Kirin970-HI3670, Kirin9000-HI36A0, Kirin980-HI3680, RAM 376, HI9500 VI, HI36A0 RAM
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U-HIU1 For Huawei CPU Kirin820-HI6290, Kirin960-HI3660, Kirin659-HI6250, Kirin710-HI6260 V100, Kirin810-H16280, HI3660 RAM, Kirin710-HI6260 V101, HI6260 V100 RAM
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