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iPhone X big power ic 338S00341
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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IP14-15 (10 in 1) Middle Layer Magnetic Reballing Fixture
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IP13 (4 in 1) Middle Layer Magnetic Reballing Fixture
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IP12 (4 in 1) Middle Layer Magnetic Reballing Fixture
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IPX-11P (6 in 1) Middle Layer Magnetic Reballing Fixture
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S21+ SM-G996U Middle Layer Magnetic Reballing Fixture
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MI10U Middle Layer Magnetic Reballing Fixture
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S20 Ultra G988U, G988B Middle Layer Magnetic Reballing Fixture
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Universal Stencil AMAOE
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Mbga-B6 Magnetic Fixture For Samsung, MTK CPU,s and Ram reballing easy
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Only 8 left in stock
Mbga-B6 Magnetic Fixture For Samsung, MTK CPU,s and Ram reballing easy
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C210-I Amaoe Soldering Iron tip
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AMAOE Mini Electric Sanding Pen
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iPhone XS XR MAX power amplifier IC 76018
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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