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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
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- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
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Density
- 64 Gb
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Organization
- x64
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Speed
- 6400 Mbps
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Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
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Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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HW16 Stencil For MT6877V SM7325 BGA254 BGA297
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OSS T210 soldering station Lead-free 2S Rapid Heating Soldering Iron Kit 75W Power Heating System With C210 soldering iron tip
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Stencil Storage Box Mijing SN-11
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Mixing Nozzle
₨ 200 Add to cart
Mixing Nozzle
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Heating Element For Quick 850/952A
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Heating Core For Quick 850
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Heating Core For Quick 858
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UV Glue Liquid Adhesive Gun
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Motor For Glue Winding Machine
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Heating Core Model : 1146B For Quick 990AD, 850A+, 850D, 990D
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Heating Core Model : 1146 For Quick 850A, 990A
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Heating Core Model : 1147 For Quick 706, 857, 957
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