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MAC 1-9 Stencil Set For MAC Pro A2159 A1706 A1707 A1534 IC CPU SSD DDR WIFI
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Huawei P30 Pro Middle Layer StenciL
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U-HIU2 For Huawei CPU Kirin990-H13690 5G, Kirin990-H13690 4G, Kirin970-HI3670, Kirin9000-HI36A0, Kirin980-HI3680, RAM 376, HI9500 VI, HI36A0 RAM
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U-HIU1 For Huawei CPU Kirin820-HI6290, Kirin960-HI3660, Kirin659-HI6250, Kirin710-HI6260 V100, Kirin810-H16280, HI3660 RAM, Kirin710-HI6260 V101, HI6260 V100 RAM
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U-UNI1 For UIS8910, UMS9230H, UMS512T, R818 CPU
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U-MIXU1 For HI36AO, SM8650, MT6985W, SM6450, MT6989W, SM4450
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U-UFS1 For EMMC, EMCP, UFS, UMCP, LPDDR
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U-SCU2 Stencil For Spreadtrum CPU SC9863A, SC9832E, SC9850, SC6531E, SC9820A, SC6500D, SC6533G, SC6531DA
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Xiaomi 12S Ultra Middle Frame Reballing Stencil
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Xiaomi 12X middle frame Reballing Stencil
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XIAOMI 12 PRO Motherboard middle layer Reballing Stencil
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Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping
Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
1 x Tin planting platform set
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