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iPhone 7 small audio IC 338S00220
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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iPhone 7 big audio IC 338S00105 Brand new
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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Samsung S23 Ultra | SM-S918U-W / 0 / D Middle Frame Reballing Stencil
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Samsung S22 SM-S901U/W/O/D/E Reballing Stencil
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Xiaomi 12S Ultra Middle Frame Reballing Stencil
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Xiaomi 12X middle frame Reballing Stencil
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XIAOMI 12 PRO Motherboard middle layer Reballing Stencil
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S21+SM-G996U/O/D/W middle frame Reballing Stencil
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Samsung S20 SM-G980FG981BN Middle Layer Reballing Stencil
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Samsung S20 SM-G986B 985F 986B Middle Layer Reballing Stencil
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Only 9 left in stock
Samsung S20 SM-G986B985F986B Middle Layer Reballing Stencil
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Samsung S20 SM-G986B985F986N Middle Layer Reballing Stencil
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Samsung S20-G988BBR Middle Layer Reballing Stencil
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Samsung S10 5G-G977 Middle Layer Reballing Stencil
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U2 610A3B charging IC for iphone 8/8Plus/x/xs/xsmax Refurbished
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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iPhone 7 crystal 19.2
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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iPhone 7 68827 power supply IC
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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