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iPhone 7 small audio IC 338S00220
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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Relife SAM EU4 Exynos CPU Stencil For Samsung 3830, Exynos 9609, 2100, 8895, 1080, 9815 CPU
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Relife SAM EU3 Exynos CPU Stencil For Exynos 9820, 9610, 990, 7885, 980 CPU
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iPhone 7 big audio IC 338S00105 Brand new
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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Huawei P30 Pro Middle Layer StenciL
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U-HIU2 For Huawei CPU Kirin990-H13690 5G, Kirin990-H13690 4G, Kirin970-HI3670, Kirin9000-HI36A0, Kirin980-HI3680, RAM 376, HI9500 VI, HI36A0 RAM
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U-HIU1 For Huawei CPU Kirin820-HI6290, Kirin960-HI3660, Kirin659-HI6250, Kirin710-HI6260 V100, Kirin810-H16280, HI3660 RAM, Kirin710-HI6260 V101, HI6260 V100 RAM
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U-MIXU1 For HI36AO, SM8650, MT6985W, SM6450, MT6989W, SM4450
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Samsung S23 Ultra | SM-S918U-W / 0 / D Middle Frame Reballing Stencil
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Samsung S22 SM-S901U/W/O/D/E Reballing Stencil
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S21+SM-G996U/O/D/W middle frame Reballing Stencil
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Samsung S20 SM-G980FG981BN Middle Layer Reballing Stencil
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Samsung S20 SM-G986B 985F 986B Middle Layer Reballing Stencil
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Samsung S20 SM-G986B985F986B Middle Layer Reballing Stencil
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Samsung S20 SM-G986B985F986N Middle Layer Reballing Stencil
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Samsung S20-G988BBR Middle Layer Reballing Stencil
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Samsung S10 5G-G977 Middle Layer Reballing Stencil
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