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RELIFE RL-001H Rotatory Storage Box Professional Classified Storage
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343S00264-AO Power iC For iPad Mini 5 / Pro 12.9
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YCS Q18 Multifunctional Phone LCD Screen Removal Fixture
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YCS Curved Screen Sealant Glue 25ML
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2UUL DA21 Vajra Wire for Screen Separation 0.035MM*100M
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Tooth type Mijing Disassembly Machine Multifunctional Multi-purpose for Blade Opener for
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RELIFE RL-309AW wireless digital display 8-port charger 100W high power built-in smart sleep switch supports PD 3.0 and QC 3.0.
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Mechanic DG200 is a high-performance electric glue remover designed for efficient screen glue removal. With adjustable speed, stainless steel needles, and a Type-C charging port, it makes glue removal easier and faster
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iP6S-15 LCD Screen iC Reballing Stencil
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iPhone 8 8P X wifi IC 339S00399
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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iPhone 7 small audio IC 338S00220
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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