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AMAOE U-APU3 Stencil For RAM A10/A11/A12/A13/A14/A15/A16
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1616A0 U2 USB for iphone 13 13 Pro Max 13Mini Charging TryStar
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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338S00770-B0 Charger IC For iPhone 13 13Pro 13Promax 13Mini
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iPhone X-12 10 in 1 Middle Layer Magnetic Reballing Fixture MBGA B1
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SAM17 Amaoe Stencil For Exynos2200, SM8450 CPU, RAM
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Mbga-B5 Magnetic Fixture For Quallcom CPU & Ram Reballing Easy
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Mbga-B14 AMAOE Magnetic Fixture For (Samsung Exynos CPU)
Supported CPU for Reballing:-
Exynos 9820
Exynos 9815
Exynos 9611
Exynos 9609
Exynos 9610
Exynos 8895
Exynos 8890
Exynos 7904
Exynos 7884
Exynos 7885
Exynos 7880
Exynos 7870
Exynos 7580
Exynos 7570
Exynos 7420
Exynos 3475
Exynos 1080
Exynos 980
Exynos 880
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Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping
Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
1 x Tin planting platform set
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Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping
Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
1 x Tin planting platform set1
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IPhone 7-11 Board Swap Reballing & Cleaning Fixture
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Mbga B12 iPhone CPU (A8-A15 8in1) Magnetic Reballing Fixture
₨ 13,400 Add to cart
Only 6 left in stock
Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-B3 (EMMC/EMCP/UFS 7in1)
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Mbga Tin Planting Station - Mbga-B7 (Android Phone CPU)
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Mbga Tin Planting Station - Mbga-B8 (Android Phone CPU)
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Mbga/MFix-UBase
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