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Showing 1–16 of 17 resultsSorted by latest
K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
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- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
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Density
- 64 Gb
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Organization
- x64
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Speed
- 6400 Mbps
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Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
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Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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KOOCU 5 in 1 Magnetic Screwdriver For All iPhone, Android & China Models
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LCD Cutting Wire 0.03mm KOOCU JGS-9
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Solder Wick 2.5mm KOOCU CP2015
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Jumper Wire For iPhone iC Chip jumpering
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iPhone X-12 10 in 1 Middle Layer Magnetic Reballing Fixture MBGA B1
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Mbga-B5 Magnetic Fixture For Quallcom CPU & Ram Reballing Easy
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Mbga-B14 AMAOE Magnetic Fixture For (Samsung Exynos CPU)
Supported CPU for Reballing:-
Exynos 9820
Exynos 9815
Exynos 9611
Exynos 9609
Exynos 9610
Exynos 8895
Exynos 8890
Exynos 7904
Exynos 7884
Exynos 7885
Exynos 7880
Exynos 7870
Exynos 7580
Exynos 7570
Exynos 7420
Exynos 3475
Exynos 1080
Exynos 980
Exynos 880
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IPhone 7-11 Board Swap Reballing & Cleaning Fixture
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Mbga B12 iPhone CPU (A8-A15 8in1) Magnetic Reballing Fixture
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Only 6 left in stock
Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-B3 (EMMC/EMCP/UFS 7in1)
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Mbga Tin Planting Station - Mbga-B7 (Android Phone CPU)
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Mbga Tin Planting Station - Mbga-B8 (Android Phone CPU)
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