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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
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- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
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Density
- 64 Gb
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Organization
- x64
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Speed
- 6400 Mbps
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Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
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Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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DY 12 Pin Light iC For iPhone 5 5S 6 6Plus
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UMF cable (Ultimate Multi-Functional Cable) All boot cable
Features:
The Best multi-functional boot cable
Micro USB RJ45 All in One Multifunction Boot Cable
Support MTKSPD boot
Support L G 56k Download mode
Support L G 130k Download mode
Support Sam 300k Download mode
Support RJ45 Converter FOR UART
Support L G 910K Download mode
Support Qualcom EDL (Emergency Download)DFCQualcomm HSUSB diagnostic 9008
Support fast charge
Micro USB to Type-C Adapter
Type C to USB 3.0 ADPATER
6 switch button easy for switching different mode
Support all boxes and dongle available in the market
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iPhone X-12 10 in 1 Middle Layer Magnetic Reballing Fixture MBGA B1
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Mbga-B5 Magnetic Fixture For Quallcom CPU & Ram Reballing Easy
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Mbga-B14 AMAOE Magnetic Fixture For (Samsung Exynos CPU)
Supported CPU for Reballing:-
Exynos 9820
Exynos 9815
Exynos 9611
Exynos 9609
Exynos 9610
Exynos 8895
Exynos 8890
Exynos 7904
Exynos 7884
Exynos 7885
Exynos 7880
Exynos 7870
Exynos 7580
Exynos 7570
Exynos 7420
Exynos 3475
Exynos 1080
Exynos 980
Exynos 880
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IPhone 7-11 Board Swap Reballing & Cleaning Fixture
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Mbga B12 iPhone CPU (A8-A15 8in1) Magnetic Reballing Fixture
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Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-B3 (EMMC/EMCP/UFS 7in1)
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Mbga Tin Planting Station - Mbga-B7 (Android Phone CPU)
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Mbga Tin Planting Station - Mbga-B8 (Android Phone CPU)
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Mbga/MFix-UBase
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339S00033 WIFI IC For Iphone 6S/6Splus
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U2 610A3B charging IC for iphone 8/8Plus/x/xs/xsmax Refurbished
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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