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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
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- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
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Density
- 64 Gb
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Organization
- x64
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Speed
- 6400 Mbps
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Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
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Temperature
- -25 ~ 85 °C
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Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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Description:
1. Welding is not wasteful, more precise, and the sealing plug can be reused many times after use.
2. Suitable for welding on metals such as general instruments, meters, tubes, tin, iron etc.
3. After reflow, there is little residue, light color, no corrosion, high impedance, high purity,
long lasting viscosity, bright solder joints after soldering.
4. Suitable for sensor, wire, SMT repair, circuit welding, tablet phone computer repair, home appliance repair.
Features:
. No cleaning
. Easy to solder
. High activity
. Free 2 needles + Push rod
. No resistance
. No conductivity
. No repair
. Strong activity
. Bright solder joints
Uses:
. Phone repair
. Mobile phone chip welding
. Appliance repair
. BGA tin planting
. Repair and desoldering
. Component welding
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