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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
-
- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
-
Density
- 64 Gb
-
Organization
- x64
-
Speed
- 6400 Mbps
-
Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
-
Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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1616A0 U2 USB for iphone 13 13 Pro Max 13Mini Charging TryStar
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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338S00770-B0 Charger IC For iPhone 13 13Pro 13Promax 13Mini
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338S00770-B0 Charger IC For iPhone 13 13Pro 13Promax 13Mini
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1616A0 U2 USB for iphone 13 13 Pro Max 13Mini Charging TryStar
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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