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K3LK7K7 BGCP Samsung 8G LPDDR5 RAM For Qualcomm and Exynoss CPU
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- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
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Density
- 64 Gb
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Organization
- x64
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Speed
- 6400 Mbps
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Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
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Temperature
- -25 ~ 85 °C
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Package
- 496 FBGA
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H9HQ15AFAMAD UFS 2.1, 8 / 128 gb, LPDDR4X. SK HYNIX BGA254. For All MTK Phones Memory Chip – Tested
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Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping
Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
1 x Tin planting platform set
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Add to Wishlist
Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping
Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
Package includes:
1 x Tin planting platform set1
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Add to Wishlist