Subtotal: ₨ 1,680
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Showing 1–16 of 35 resultsSorted by latest
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Huawei P30 Pro Middle Layer StenciL
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U-HIU2 For Huawei CPU Kirin990-H13690 5G, Kirin990-H13690 4G, Kirin970-HI3670, Kirin9000-HI36A0, Kirin980-HI3680, RAM 376, HI9500 VI, HI36A0 RAM
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U-HIU1 For Huawei CPU Kirin820-HI6290, Kirin960-HI3660, Kirin659-HI6250, Kirin710-HI6260 V100, Kirin810-H16280, HI3660 RAM, Kirin710-HI6260 V101, HI6260 V100 RAM
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iPhone X-12 10 in 1 Middle Layer Magnetic Reballing Fixture MBGA B1
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U-MIXU1 For HI36AO, SM8650, MT6985W, SM6450, MT6989W, SM4450
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Mbga-B5 Magnetic Fixture For Quallcom CPU & Ram Reballing Easy
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Mbga-B14 AMAOE Magnetic Fixture For (Samsung Exynos CPU)
Supported CPU for Reballing:-
Exynos 9820
Exynos 9815
Exynos 9611
Exynos 9609
Exynos 9610
Exynos 8895
Exynos 8890
Exynos 7904
Exynos 7884
Exynos 7885
Exynos 7880
Exynos 7870
Exynos 7580
Exynos 7570
Exynos 7420
Exynos 3475
Exynos 1080
Exynos 980
Exynos 880
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IPhone 7-11 Board Swap Reballing & Cleaning Fixture
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Mbga B12 iPhone CPU (A8-A15 8in1) Magnetic Reballing Fixture
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Only 6 left in stock
Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-B3 (EMMC/EMCP/UFS 7in1)
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Mbga Tin Planting Station - Mbga-B7 (Android Phone CPU)
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Mbga Tin Planting Station - Mbga-B8 (Android Phone CPU)
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Mbga/MFix-UBase
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HU2 Stencil for Hi6250, Hi6220, Hi3660, Hi6620
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