mechanci - DHiCs

Product Function:

Crescent Knife: Designed for iPhone A8, A9, A10, A11, and A12 CPU BGA chips.
Precision Disassembly Tool: Crooked knife for disassembling and cleaning mobile phone motherboard sealant glue.
UV Glue Removal Tool: Ideal for cleaning and removing sealant glue from mobile phone motherboards.
Solder Paste Scraper: Perfect for BGA repair and UV glue cleaning on mobile phones.

Product Features:

Handcrafted Sharpening: Pure manual sharpening and grinding for precise cutting edges.
Gold Plating Process: Features a standardized 5UM nickel layer with real gold plating, offering excellent oxidation and corrosion resistance.
Premium 4A Material: Made from 0.1mm imported AAAA-grade steel, known for its softness, toughness, heat resistance, and wear resistance.
Non-Slip Design: 8mm diameter handle with fine lines for a comfortable, ergonomic grip.
Double Handle Construction: Crafted from 0.1mm imported AAAA steel, ensuring durability, heat resistance, and wear resistance.

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