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-
- Compatible With Samsung Xiaomi Oppo Vivo Mobiles
Applications
- 5G & Connectivity, Mobile
-
Density
- 64 Gb
-
Organization
- x64
-
Speed
- 6400 Mbps
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Voltage
- 1.8 / 1.05 / 0.9 / 0.5 V
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Temperature
- -25 ~ 85 °C
-
Package
- 496 FBGA
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DY 12 Pin Light iC For iPhone 5 5S 6 6Plus
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iPhone X-12 10 in 1 Middle Layer Magnetic Reballing Fixture MBGA B1
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Mbga-B5 Magnetic Fixture For Quallcom CPU & Ram Reballing Easy
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Mbga-B14 AMAOE Magnetic Fixture For (Samsung Exynos CPU)
Supported CPU for Reballing:-
Exynos 9820
Exynos 9815
Exynos 9611
Exynos 9609
Exynos 9610
Exynos 8895
Exynos 8890
Exynos 7904
Exynos 7884
Exynos 7885
Exynos 7880
Exynos 7870
Exynos 7580
Exynos 7570
Exynos 7420
Exynos 3475
Exynos 1080
Exynos 980
Exynos 880
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Description:
1. Welding is not wasteful, more precise, and the sealing plug can be reused many times after use.
2. Suitable for welding on metals such as general instruments, meters, tubes, tin, iron etc.
3. After reflow, there is little residue, light color, no corrosion, high impedance, high purity,
long lasting viscosity, bright solder joints after soldering.
4. Suitable for sensor, wire, SMT repair, circuit welding, tablet phone computer repair, home appliance repair.
Features:
. No cleaning
. Easy to solder
. High activity
. Free 2 needles + Push rod
. No resistance
. No conductivity
. No repair
. Strong activity
. Bright solder joints
Uses:
. Phone repair
. Mobile phone chip welding
. Appliance repair
. BGA tin planting
. Repair and desoldering
. Component welding
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IPhone 7-11 Board Swap Reballing & Cleaning Fixture
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Mbga B12 iPhone CPU (A8-A15 8in1) Magnetic Reballing Fixture
Only 6 left in stock
Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-Mbga-B4(A11-12 8in1)
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Mbga Tin Planting Station-B3 (EMMC/EMCP/UFS 7in1)
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Mbga Tin Planting Station - Mbga-B7 (Android Phone CPU)
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Mbga Tin Planting Station - Mbga-B8 (Android Phone CPU)
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Mbga/MFix-UBase
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339S00033 WIFI IC For Iphone 6S/6Splus
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U2 610A3B charging IC for iphone 8/8Plus/x/xs/xsmax Refurbished
How to replace iphone iC chips?
*Remove the chip cleanly, with hot air.
*Clean the tracks with a soldering iron, tin and flux.
*Clean the map.
*Inspect the card under the microscope.
*If we compare to the diagram on the PhoneBoard software;We observe very clearly that we will be able to put a wire to redo this connection.
*Put on some flux.
*Take a soldering iron with tin at the end.
*Pass over the chip to smooth the balls.
*Clean.
*Put on a reballing stencil.
*Spread some soldering paste.
*Heat with hot air to form the balls.
*Extract the chip by pushing with a thin tweezers.
*Check the size of the balls.
*And we end up putting the chip back. Flow, position and solder with hot air.
*We let the phone cool, we go back and the problem is solved!
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